Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for contacting a buried interconnect rail of an integrated circuit chip from the back side of the IC

Method for contacting a buried interconnect rail of an integrated circuit chip from the back side of the IC

US Patent 10985057 · Granted Apr 20, 2021

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Interconnect structure of a semiconductor component and methods for producing th2025
Method of producing an integrated circuit chip including a back-side power deliv2025
Method of producing an integrated circuit chip including a back-side power deliv2025
Device and system for cooling an electronic component2025
Method of direct bonding semiconductor components2023
Substrate, assembly and method for wafer-to-wafer hybrid bonding2023
Method for dicing a semiconductor substrate into a plurality of dies2022
Method for packaging semiconductor dies2022
Method for packaging semiconductor dies2022
Method for the electrical bonding of semiconductor components2022
Method for fabricating an optical device2022
Method of bonding semiconductor substrates2021