Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Well thermalized stripline formation for high-density connections in quantum applications

Well thermalized stripline formation for high-density connections in quantum applications

US Patent 10978769 · Granted Apr 13, 2021

Estimated economic value: $3,936,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Computer assembly housing2025
Custom thermal shields for cryogenic environments2025
Custom thermal shields for cryogenic environments2025
Superconducting qubit capacitance and frequency of operation tuning2025
Computer assembly housing2025
Cryogenic packaging for thermalization of low temperature devices2025
Cryogenic packaging for thermalization of low temperature devices2025
Cryogenic packaging for thermalization of low temperature devices2025
Ground discontinuities for thermal isolation2025
Reduced Kapitza resistance microwave filter for cryogenic environments2024
Reduced Kapitza resistance microwave filter for cryogenic environments2024
Reducing qubit frequency collisions through lattice design2024