Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Packaging structures with improved adhesion and strength

Packaging structures with improved adhesion and strength

US Patent 10971418 · Granted Apr 6, 2021

Estimated economic value: $82,801,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Multilayered transient liquid phase bonding2023
Methods to improve front-side process uniformity by back-side metallization2021
Transient liquid phase material bonding and sealing structures and methods of fo2020
Rapid thermal anneal apparatus and method2020
Multilayered transient liquid phase bonding2020
Method for controlling the amount of radiation having a predetermined wavelength2020
Transient liquid phase material bonding and sealing structures and methods of fo2020
Packaging structures with improved adhesion and strength2019
Packaging structures with improved adhesion and strength2019
Schottky contact structure for semiconductor devices and method for forming such2019
Schottky contact structure for semiconductor devices and method for forming such2018
Electron radiation monitoring electrode system to prevent gold spitting and resi2017