Semiconductor package and module

Assignee

• Mitsubishi Electric

Inventors

• Hideharu YOSHIOKA (8 patents)
• Akimichi Hirota (19 patents)
• Naofumi Yoneda (62 patents)
• Hidenori Ishibashi (25 patents)
• Shintaro Shinjo (28 patents)
• Kiyoshi Ishida (35 patents)
• Hideki Morishige (8 patents)

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