{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Spoked solder pad to improve solderability and self-alignment of integrated circuit packages", "item": "https://www.patentleaderboard.com/patent/10957663"}]}
Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Spoked solder pad to improve solderability and self-alignment of integrated circuit packages

Spoked solder pad to improve solderability and self-alignment of integrated circuit packages

US Patent 10957663 · Granted Mar 23, 2021

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Flexible, interruptible radial bus and bus-mounted bead device2023
Flexible, interruptible radial bus and bus-mounted bead device2020
Spoked solder pad2019
Spoked solder pad2019
Spoked solder pad to improve solderability and self-alignment of integrated circ2018
Spoked solder pad2018
Keychain with holder for digital memory card2010