Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Modified leadframe design with adhesive overflow recesses

Modified leadframe design with adhesive overflow recesses

US Patent 10957634 · Granted Mar 23, 2021

Estimated economic value: $63,753,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Leadframe with varying thicknesses and method of manufacturing semiconductor pac2025
Capless semiconductor package with a micro-electromechanical system (mems)2025
Method for manufacturing leadless semiconductor package with wettable flanks2025
Method of manufacturing semiconductor devices and corresponding semiconductor de2025
Lead stabilization in semiconductor packages2025
Lead frame for improving adhesive fillets on semiconductor die corners2024
Lead frame for improving adhesive fillets on semiconductor die corners2024
Flat no-lead package with surface mounted structure2024
Flat no-lead package with surface mounted structure2024
Leadframe package with pre-applied filler material2024
Die embedded in substrate with stress buffer2024
Flat no-lead package with surface mounted structure2024