Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for bond wire testing in an integrated circuit

Method and apparatus for bond wire testing in an integrated circuit

US Patent 10955465 · Granted Mar 23, 2021

Estimated economic value: $169,068,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Identifying potentially-defective picture elements in an active-matrix display p2020
Thermal control using phase-change material2019
Test fixture2018
Test fixture2018
Test fixture2018
Capacitive opens testing of low profile components2017
Method and apparatus for testing electrical connections on a printed circuit boa2017
Electronic assembly test system2016
Electronic assembly test system2016
Engaging test slots2015
Fast open circuit detection for open power and ground pins2014
Low capacitance probe for testing circuit assembly2014