Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Selective and self-limiting tungsten etch process

Selective and self-limiting tungsten etch process

US Patent 10950498 · Granted Mar 16, 2021

Estimated economic value: $56,717,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Pulsed plasma (DC/RF) deposition of high quality C films for patterning2025
Pulsed plasma (DC/RF) deposition of high quality C films for patterning2025
Processes for depositing SiB films2025
Conformal molybdenum deposition2025
High density carbon films for patterning applications2025
High density carbon films for patterning applications2025
Method of tuning film properties of metal nitride using plasma2025
Low resistivity metal contact stack2025
Methods and apparatus for seam reduction or elimination2025
Electronic device fabrication using area-selective deposition2025
Electronic device fabrication using area-selective deposition2025
Seamless gapfill of metal nitrides2025