Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Stacked type capacitor package structure without carbon paste layer, stacked type capacitor thereof, and polymer composite layer

Stacked type capacitor package structure without carbon paste layer, stacked type capacitor thereof, and polymer composite layer

US Patent 10923289 · Granted Feb 16, 2021

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Amorphous layers for reducing copper diffusion and method forming same2025
Amorphous layers for reducing copper diffusion and method forming same2024
Edge patterns of microelectromechanical systems (MEMS) microphone backplate hole2022
Electromagnetic shielding element, and transmission line assembly and electronic2022
Amorphous layers for reducing copper diffusion and method forming same2022
Stacked type capacitor without carbon paste layer, manufacturing method thereof 2021
Balanced push-pull loudspeaker device, a control method thereof, and an audio pr2017
Micro-electro-mechanical system (MEMS) device with multi-dimensional spring stru2017
Mirco-electro-mechanical system device2017
Signal processing method of multiple mirco-electro-mechanical system (MEMS) devi2017
Optical film structure having a light absorbing layer that improves the contrast2016
Part of loudspeaker2016