Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package with protected sidewall and method of forming the same

Semiconductor package with protected sidewall and method of forming the same

US Patent 10910287 · Granted Feb 2, 2021

Estimated economic value: $24,119,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Sensor die package2025
Slanted glass edge for image sensor package2025
Device and method for fabricating ceramic reinforced composite coating based on 2025
Multi-chip package2024
Wafer level proximity sensor2024
Slanted glass edge for image sensor package2024
Method for manufacturing a wafer level chip scale package (WLCSP)2024
Proximity sensor with integrated ALS2023
WLCSP with transparent substrate and method of manufacturing the same2023
Crack detection integrity check2023
WLCSP package with different solder volumes2023
Multi-chip package2023