{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Semiconductor integrated device with electrical contacts between stacked dies and corresponding manufacturing process", "item": "https://www.patentleaderboard.com/patent/10906801"}]}
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Home › Semiconductor integrated device with electrical contacts between stacked dies and corresponding manufacturing process

Semiconductor integrated device with electrical contacts between stacked dies and corresponding manufacturing process

US Patent 10906801 · Granted Feb 2, 2021

Estimated economic value: $24,119,000 ⓘ

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