Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Resin composition, prepreg, metal-clad laminate, and wiring board

Resin composition, prepreg, metal-clad laminate, and wiring board

US Patent 10887984 · Granted Jan 5, 2021

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Organic insulator and wiring board2025
Resin composition, prepreg, metal-clad laminate sheet, and wiring board2024
Organic board, metal-clad laminate, and wiring board2023
Prepreg and laminate for circuit board2022
Laminated uncured sheet2022
Organic insulating body, metal-clad laminate and wiring board2020
Organic insulator, metal-clad laminate and wiring board2020
Adhesive-attached copper foil, copper-clad laminate, and wiring substrate2020
Resin composition, prepreg, metal-clad laminated plate, and wiring board2019
Method for preparing p-isobutylstyrene1995
Method for preparing alpha-(4-isobutylphenyl)propionic acid or its precursor1993
Method for preparing .alpha.-(4-isobutylphenyl)propionic acid or its precursor1992