Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Highly thermally conductive dielectric structure for heat spreading in component carrier

Highly thermally conductive dielectric structure for heat spreading in component carrier

US Patent 10880988 · Granted Dec 29, 2020

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Component carrier with surface mounted components connected by high density conn2025
Component embedded in component carrier and having an exposed side wall2025
Component embedded in component carrier and having an exposed side wall2025
Component carrier with stack-stack connection for connecting components2024
Z-axis interconnection with protruding component2024
Interposer-type component carrier and method of manufacturing the same2023
Compensating misalignment of component carrier feature by modifying target desig2023
Protection layer for panel handling systems2023
Component embedded in component carrier and having an exposed side wall2023
Heat removal mechanism for stack-based electronic device with process control co2022
Electronic module with single or multiple components partially surrounded by a t2022
Component carrier having a three dimensionally printed wiring structure2022