Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Optoelectronic module having dual encapsulation with opening for receiving an optical assembly

Optoelectronic module having dual encapsulation with opening for receiving an optical assembly

US Patent 10872999 · Granted Dec 22, 2020

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Light emitting module combining enhanced safety features and thermal management2025
Light emitting module combining enhanced safety features and thermal management2025
Light emitting module combining enhanced safety features and thermal management2025
Optoelectronic modules including an optical emitter and optical receiver2025
Optoelectronic modules and wafer-level methods for manufacturing the same2024
Manufacture of optical light guides2024
Yard control features2024
Compact opto-electronic modules and fabrication methods for such modules2024
Compact opto-electronic modules and fabrication methods for such modules2024
Wafer-level manufacture of micro-devices and related two-piece devices, in parti2024
Optoelectronic modules having locking assemblies and methods for manufacturing t2023
Optoelectronic modules having locking assemblies and methods for manufacturing t2023