Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Air-cavity semiconductor package with low cost high thermal carrier

Air-cavity semiconductor package with low cost high thermal carrier

US Patent 10872837 · Granted Dec 22, 2020

Estimated economic value: $28,282,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

System in package with flip chip die over multi-layer heatsink stanchion2025
Package architecture utilizing wafer to wafer bonding2024
System in package with flip chip die over multi-layer heatsink stanchion2024
Package architecture utilizing wafer to wafer bonding2023
Methods of forming integrated circuit devices using cutting tools to expose meta2022
Semiconductor package with floating heat spreader and process for making the sam2022
Electronic package arrangements and related methods2021
Structures for spatial power-combining devices2020
Environmental protection for wafer level and package level applications2020
Semiconductor package with floating heat spreader and process for making the sam2020
Environmental protection for wafer level and package level applications2020
Ring-frame power package2019