Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Ion through-substrate via

Ion through-substrate via

US Patent 10867891 · Granted Dec 15, 2020

Estimated economic value: $3,031,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device including germanium region disposed in semiconductor substr2025
Image sensor having an improved structure for small pixel designs2025
Stacked structure for CMOS image sensors2025
Stacked integrated circuits with redistribution lines2025
3DIC interconnect apparatus and method2025
Multi-wafer integration2025
Device over photodetector pixel sensor2025
Hybrid bonding with uniform pattern density2025
High-speed readout image sensor2025
3DIC seal ring structure and methods of forming same2025
3DIC seal ring structure and methods of forming same2025
Semiconductor devices and methods of manufacture thereof2025