Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and system for co-packaging photonics integrated circuit with an application specific integrated circuit

Method and system for co-packaging photonics integrated circuit with an application specific integrated circuit

US Patent 10866376 · Granted Dec 15, 2020

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Setup and training of links between host devices and optical modules including m2025
Apparatus, system, and method for searching compressed data2018
System and method for link training of a backplane physical layer device operati2017
System and method for data flow identification and alignment in a 40/100 gigabit2016
Driver chip for minimizing transmission impairments and for boosting signal tran2016
Inband management of ethernet links2015
Method and system for speed negotiation for twisted pair links using intelligent2015
System and method for increasing input/output speeds in a network switch2015
System and method for 10/40 gigabit ethernet multi-lane gearbox2015
Method and system for speed negotiation for twisted pair links in fibre channel 2015
Multi-protocol communications receiver with shared analog front-end2015
Multi-channel multi-protocol transceiver with independent channel configuration 2014