Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Molded semiconductor package having a package-in-package structure and methods of manufacturing thereof

Molded semiconductor package having a package-in-package structure and methods of manufacturing thereof

US Patent 10861828 · Granted Dec 8, 2020

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Substituted amino triazolopyrimidine and amino triazolopyrazine adenosine recept2025
Package-in-package structure for semiconductor devices and methods of manufactur2019
Package-in-package structure for semiconductor devices and methods of manufactur2019
Semiconductor device with webbing between leads2015
Electronic array and chip package2015
Semiconductor package with multiple chips and substrate in metal cap2014
Integrated circuit package and a method for forming an integrated circuit packag2013
Method for manufacturing a semiconductor component that includes a field plate2012
Magnetically alignable integrated circuit device2011
Semiconductor power device having a diamond shaped metal interconnect scheme2005