Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electronic assemblies having a mesh bond material and methods of forming thereof

Electronic assemblies having a mesh bond material and methods of forming thereof

US Patent 10861816 · Granted Dec 8, 2020

Estimated economic value: $746,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Power electronics assembly having vertically stacked transistors2025
Morphing origami structures with light-responsive polymers2025
Remaining useful life determination for power electronic devices2025
Charging a battery of an electric vehicle hovering in the air2025
Linear approximation of a complex number magnitude2025
Configurable dynamic wireless power transfer transmission system2025
Morphing structures with light-responsive polymers2025
Dynamic adjustment of flexible mirror using photochromatic material2025
Cooling system for aircraft components2025
Methods and apparatus to compensate for radar system calibration changes2025
System and method for adjusting one or more properties of a deformable lens2025
Transient liquid phase bonding compositions and power electronics assemblies inc2025