Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wire bond clamp design and lead frame capable of engaging with same

Wire bond clamp design and lead frame capable of engaging with same

US Patent 10861777 · Granted Dec 8, 2020

Estimated economic value: $35,035,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Mechanical couplings designed to resolve process constraints2024
Mechanical couplings designed to resolve process constraints2024
Mechanical couplings designed to resolve process constraints2024
Stud bump for wirebonding high voltage isolation barrier connection2024
Packaged isolation barrier with integrated magnetics2024
Integrated circuit die pad cavity2024
Integrated circuit die pad cavity2024
Semiconductor die mounted in a recess of die pad2024
Semiconductor die mounted in a recess of die pad2024
Semiconductor device packages with high angle wire bonding and non-gold bond wir2023
Electronic device with exposed tie bar2023
Exposed heat-generating devices2023