Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for curing solder paste on a thermally fragile substrate

Method for curing solder paste on a thermally fragile substrate

US Patent 10849239 · Granted Nov 24, 2020

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Transferring viscous materials2025
Controlled deposition method of a donor material onto a target surface and plate2025
Device and method of filling grooves2025
Multi-layer release stack for light induced transfer of components2025
Controlled deposition of a functional material onto a target surface2025
Method for curing solder paste on a thermally fragile substrate2023
Method for performing delamination of a polymer film2022
Method for depositing a functional material on a substrate2021
Method for deposting a functional material on a substrate2020
Substrate comprising an electrical circuit pattern, method and system for provid2019
Method and system for forming a patterned structure on a substrate2019
Apparatus and method for contactless transfer and soldering of chips using a fla2019