Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Mechanical stress decoupling for microelectromechanical systems (MEMS) elements with gel-filling

Mechanical stress decoupling for microelectromechanical systems (MEMS) elements with gel-filling

US Patent 10843916 · Granted Nov 24, 2020

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Media-resistant pressure sensor for large pressure ranges2025
Differential gas sensor with two sensor components and use for detection of gase2025
Differential gas sensor with two sensor components and use for detection of gase2025
Semiconductor component including an electronic component based on polycrystalli2025
Semiconductor die with sensor section located at the edge2025
Pressure sensors and method for forming a MEMS pressure sensor2025
Pressure sensors and method for forming a MEMS pressure sensor2025
Semiconductor die with pressure and acceleration sensor elements2025
Capacitive microelectromechanical device and method for forming a capacitive mic2025
MEMS devices with support structures and associated production methods2025
Sensor device including sensor unit for a gaseous medium2025
Universal phantom for calibration and verification of optical and radiation syst2024