Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Manufacturing method of semiconductor structure

Manufacturing method of semiconductor structure

US Patent 10818612 · Granted Oct 27, 2020

Estimated economic value: $13,071,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Rinse process after forming fin-shaped structure2025
Semiconductor device structure with magnetic element2025
Semiconductor device structure with a protection cap at an end portion of a cond2025
Audio latency calibration method, electronic device and computer-readable storag2025
Method of forming semiconductor device having at least one via including concave2025
Wafer level package with polymer layer delamination prevention design and method2025
Arched membrane structure for MEMS device2025
Arched membrane structure for MEMS device2024
Semiconductor device structure with magnetic element2024
Package structure with a barrier layer2024
Package structure with a barrier layer2024
Semiconductor device having at least one via including concave portions on sidew2024