Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Self-aligned airgaps with conductive lines and vias

Self-aligned airgaps with conductive lines and vias

US Patent 10784156 · Granted Sep 22, 2020

Estimated economic value: $3,040,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Reduced capacitance between power via bar and gates2025
Planar high-density aluminum capacitors for stacking and embedding2025
Backside self aligned skip via2025
Airgap spacer for power via2025
Semiconductor passive device integration for silicon-on-insulator substrate2025
Self-forming barrier for use in air gap formation2025
Self-forming barrier for use in air gap formation2025
Early backside first power delivery network2025
Early backside first power delivery network2025
Source/drain contact at tight cell boundary2025
BEOL interconnect subtractive etch super via2025
BEOL interconnect subtractive etch super via2025