Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Three-dimensional memory device containing through-memory-level contact via structures

Three-dimensional memory device containing through-memory-level contact via structures

US Patent 10727248 · Granted Jul 28, 2020

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor die including edge ring structures and methods for making the same2022
Semiconductor die including edge ring structures and methods for making the same2022
Three-dimensional memory device containing through-memory-level contact via stru2021
Three-dimensional memory device containing through-memory-level contact via stru2021
Three-dimensional memory device containing through-memory-level contact via stru2021
Three-dimensional memory device containing different pedestal width support pill2019
Semiconductor device and method for manufacturing the same2018
Semiconductor device and method for manufacturing the same2016
Semiconductor device and method of manufacturing the same2016
Semiconductor integrated circuit device and process for manufacturing the same2016
Semiconductor integrated circuit device and process for manufacturing the same2015
Semiconductor integrated circuit device and process for manufacturing the same2013