Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Robust integrated circuit package

Robust integrated circuit package

US Patent 10720379 · Granted Jul 21, 2020

Estimated economic value: $89,584,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Limiting failures caused by dendrite growth on semiconductor chips2025
High performance semiconductor device2024
Packaged transistor having die attach materials with channels and process of imp2023
Systems and processes for increasing semiconductor device reliability2023
Systems and processes for increasing semiconductor device reliability2023
High output power density radio frequency transistor amplifiers in flat no-lead 2023
High reliability semiconductor devices and methods of fabricating the same2022
Integrated circuit having die attach materials with channels and process of impl2022
Light-emitting diodes, light-emitting diode arrays and related devices2022
Systems and processes for increasing semiconductor device reliability2022
Systems and processes for increasing semiconductor device reliability2022
Substrate based light emitter devices, components, and related methods2021