Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Solid-state wafer bonding of functional materials on substrates and self-aligned contacts

Solid-state wafer bonding of functional materials on substrates and self-aligned contacts

US Patent 10679964 · Granted Jun 9, 2020

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Charging method, electronic device and storage medium2025
Soft read operations with progressive data output2025
Method for computing fastest route on road networks with dynamic traffic informa2025
Sharp, vertically aligned nanowire electrode arrays, high-yield fabrication and 2024
Porous platinum nanorod electrode array flexible sensor devices and fabrication2024
Vector operation acceleration with convolution computation unit2024
Method for sludge dewatering using kitchen waste to synergistically enhance anae2024
Battery module, charging control method, and storage medium2024
Vector operation acceleration with convolution computation unit2023
Automatic read calibration operations2023
Quasi-solid-state electrolyte based on ionic liquid for use in lithium battery a2023
GPU-accelerated locally injective shape deformation2022