Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Thin diamond film bonding providing low vapor pressure at high temperature

Thin diamond film bonding providing low vapor pressure at high temperature

US Patent 10675841 · Granted Jun 9, 2020

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Z-shaped girt2019
Vacuum transistor structure using graphene edge field emitter and screen electro2019
Bonding method for thin film diamond providing low vapor pressure at high temper2018
Bonding method for thin film diamond providing low vapor pressure at high temper2018
Chemically stable visible light photoemission electron source2016
Chemically stable visible light photoemission electron source2016
Thin diamond film bonding providing low vapor pressure at high temperature2016
Thin diamond film bonding providing low vapor pressure at high temperature2016
Method of making an integrally gated carbon nanotube field ionizer device2011
Integrally gated carbon nanotube ionizer device2011
Method and apparatus for regulating electron emission in field emitter devices2004
Automatically sharp field emission cathodes2001