Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Quad flat no lead package and method of making

Quad flat no lead package and method of making

US Patent 10665475 · Granted May 26, 2020

Estimated economic value: $27,194,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Quad flat no lead package and method of making2023
Quad flat no lead package and method of making2023
Front side laser-based wafer dicing2023
Integrated circuit backside metallization2022
Die matrix expander with partitioned subring2021
Integrated circuit backside metallization2020
Semiconductor die singulation2020
Stern tube sealing device2018
Circuit substrate interconnect2017
Method of making a QFN package2016
Semiconductor die collet2013
Semiconductor die collet and method2010