Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Apparatuses and methods to prevent or minimize the effect of voids in bonded systems

Apparatuses and methods to prevent or minimize the effect of voids in bonded systems

US Patent 10618264 · Granted Apr 14, 2020

Estimated economic value: $33,174,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

High speed, three-dimensional locating2020
Variable resolution light radar system2019
Remote source light-guiding light assembly2019
System and method for contactless energy transfer to a moving platform2019
Searchlights with diffusers for uniformly projecting light2019
Light detection and ranging (LIDAR) scanning systems and methods2019
Light assembly having light homogenizer2018
Compensation technique for spatial non-uniformities in solar simulator systems2018
Multi-directional, multi-spectral star tracker with a common aperture and common2018
Flashlamp degradation monitoring system and method2018
Rigidly mounted tracking solar panel and method2018
Laser illuminating system and method for selectively illuminating a zone of cove2018