Inductors formed with through glass vias

Assignee

• Qualcomm

Inventors

• Changhan Hobie Yun (127 patents)
• Mario Francisco Velez (104 patents)
• Nosun PARK (15 patents)
• Wei-Chuan Chen (72 patents)
• Niranjan Sunil Mudakatte (35 patents)
• Xiaoju YU (7 patents)
• Paragkumar Ajaybhai Thadesar (14 patents)
• Jonghae Kim (241 patents)

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