Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Hybrid printed circuit assembly with low density main core and embedded high density circuit regions

Hybrid printed circuit assembly with low density main core and embedded high density circuit regions

US Patent 10609819 · Granted Mar 31, 2020

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Liquid crystal polymer embedded microelectronics device2024
Method of making a fusion bonded circuit structure2020
Fusion bonded liquid crystal polymer electrical circuit structure2019
Electrodeposited contact terminal for use as an electrical connector or semicond2019
Fusion bonded liquid crystal polymer circuit structure2018
Method of making an electrical connector having electrodeposited terminals2017
Low profile electrical interconnect with fusion bonded contact retention and sol2017
Hybrid printed circuit assembly with low density main core and embedded high den2017
Performance enhanced semiconductor socket2017
High performance surface mount electrical interconnect2017
Area array semiconductor device package interconnect structure with optional pac2017
Direct metalization of electrical circuit structures2017