Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package with chamfered corners and related methods

Semiconductor package with chamfered corners and related methods

US Patent 10608042 · Granted Mar 31, 2020

Estimated economic value: $4,719,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

System and method for timing personal physical activity2025
Image sensor semiconductor packages and related methods2022
Image sensor packages and related methods2022
Flexible interconnect sensing devices and related methods2021
Semiconductor package with chamfered corners and related methods2019
Image sensor semiconductor packages and related methods2019
Integrated circuit packages including high density bump-less build up layers and2018
Imaging systems with flip chip ball grid arrays2016
Integrated circuit package and method of manufacturing same2011
Reducing stress in a flip chip assembly2010
Package and method for attaching an integrated heat spreader2007