Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Ultrasound transducer and method for wafer level front face attachment

Ultrasound transducer and method for wafer level front face attachment

US Patent 10596598 · Granted Mar 24, 2020

Estimated economic value: $12,343,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods and systems for ultrasound-assisted endoscopy2025
Methods and systems for ultrasound-assisted endoscopy2025
Cleanable and sterilizable electrical connector for medical devices2025
Methods for forming an invasive deployable transducer using shape memory polymer2025
Methods for forming an invasive deployable transducer using shape memory polymer2025
Methods for forming an invasive deployable transducer using shape memory polymer2025
Methods and systems for ground recover in a transducer array2024
Methods and systems for a multi-frequency transducer array2024
System and method of signal processing for ultrasound arrays with mechanically a2024
Micromachined ultrasonic transources with dual out-of-plane and in-plane actuati2024
Micromachined ultrasonic transources with dual out-of-plane and in-plane actuati2024
Micromachined ultrasonic transducers with non-coplanar actuation and displacemen2024