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Home › Au—Sn—Ag-based solder alloy and solder material, electronic component sealed with the same Au—Sn—Ag based solder alloy or solder material, and electronic component mounting device

Au—Sn—Ag-based solder alloy and solder material, electronic component sealed with the same Au—Sn—Ag based solder alloy or solder material, and electronic component mounting device

US Patent 10589387 · Granted Mar 17, 2020

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