{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Metallized particle interconnect with solder components", "item": "https://www.patentleaderboard.com/patent/10588219"}]}

Home › Metallized particle interconnect with solder components

Metallized particle interconnect with solder components

US Patent 10588219 · Granted Mar 10, 2020

Estimated economic value: $1,254,000 ⓘ

Assignee

IBM

Inventors

Layne A. Berge (60 patents)
John R. Dangler (124 patents)
Matthew S. Doyle (154 patents)
Jesse Hefner (10 patents)

View full patent text on Google Patents →