Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods of forming one or more covered voids in a semiconductor substrate

Methods of forming one or more covered voids in a semiconductor substrate

US Patent 10580687 · Granted Mar 3, 2020

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Integrated assemblies and methods of forming integrated assemblies2025
Method and apparatus providing multi-planed array memory device2025
Sparse piers for three-dimensional memory arrays2025
Dense piers for three-dimensional memory arrays2025
Microelectronic devices including staircase structures, and related memory devic2025
Memory device including different dielectric structures between blocks2024
Integrated circuitry, memory circuitry comprising strings of memory cells, and m2024
Methods of cooling semiconductor devices2024
Memory device including different dielectric structures between blocks2023
Integrated assemblies and methods of forming integrated assemblies2023
Integrated assemblies, and methods of forming integrated assemblies2022
Method of fabricating electronic devices comprising removing sacrificial structu2022