Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Apparatus, system, and method for cooling multi-chip modules via clustered fluid-cooled plates

Apparatus, system, and method for cooling multi-chip modules via clustered fluid-cooled plates

US Patent 10575438 · Granted Feb 25, 2020

Estimated economic value: $7,113,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Apparatus, system, and method for utilizing package stiffeners to attach cable a2022
Apparatus, system, and method for dynamic compensation of heatsink-clamping mech2021
Apparatus, system, and method for increasing the cooling efficiency of cold plat2021
Apparatus, system, and method for cooling multi-chip modules via clustered fluid2021
Apparatus, system, and method for cooling multi-chip modules via clustered fluid2021
Apparatus, system, and method for cooling multi-chip modules via clustered fluid2021
Apparatus, system, and method for dynamic compensation of heatsink-clamping mech2021
Apparatus, system, and method for mitigating warpage of integrated circuits duri2021
Lid for semiconductor electronic package2020
Apparatus, system, and method for increasing the cooling efficiency of cold plat2020
Lid for semiconductor electronic package2020
Systems and associated methods for controllably cooling computer components2020