Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Combined heat sink and photon harvestor

Combined heat sink and photon harvestor

US Patent 10561011 · Granted Feb 11, 2020

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for packaging an integrated circuit (IC) package with embedded heat sprea2024
Integrated circuit (IC) package with embedded heat spreader in a redistribution 2023
Combined heat sink and photon harvestor2020
Laminate-based package with internal overmold2019
Air-cavity package with dual signal-transition sides2019
Air-cavity package with enhanced package integration level and thermal performan2019
Air cavity package2019
Air-cavity package with enhanced package integration level and thermal performan2018
Air-cavity package with two heat dissipation interfaces2018
Air-cavity package with dual signal-transition sides2018
Semiconductor package with lid having lid conductive structure2017
Hollow-cavity flip-chip package with reinforced interconnects and process for ma2017