Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of forming a plurality of electronic component packages

Method of forming a plurality of electronic component packages

US Patent 10546833 · Granted Jan 28, 2020

Estimated economic value: $17,459,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Fingerprint sensor and button combinations and methods of making same2025
Fingerprint sensor and button combinations and methods of making same2023
Packaging for fingerprint sensors and methods of manufacture2023
Fingerprint sensor and button combinations and methods of making same2021
Packaging for fingerprint sensors and methods of manufacture2020
Packaging for fingerprint sensors and methods of manufacture2020
Edge-effect mitigation for capacitive sensors2019
Fingerprint sensor and button combinations and methods of making same2019
Semiconductor package for sensor applications2018
Packaging for fingerprint sensors and methods of manufacture2017
Method of forming a plurality of electronic component packages2017
Fingerprint sensor and button combinations and methods of making same2017