Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › 3D Chip-on-wager-on-substrate structure with via last process

3D Chip-on-wager-on-substrate structure with via last process

US Patent 10535631 · Granted Jan 14, 2020

Estimated economic value: $2,940,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Device of encryption and decryption and method for processing data2025
Package and manufacturing method thereof2025
Semiconductor structure and method manufacturing the same2025
Method of manufacturing semiconductor devices with system on chip devices2025
Semiconductor structure and manufacturing method thereof2025
Structure having thermal dissipation structure therein and manufacturing method 2025
Thermo-electric cooler for dissipating heat of optical engine2025
Integrated circuit package and method2025
Semiconductor device having underfill surrounding bottom package and solder ball2025
Apparatus, system and method2025
Chip stack structure with conductive plug and method for forming the same2025
3D integrated circuit (3DIC) structure2025