Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Package structure of folding magnetic coupling isolator and leadframe component and manufacturing method thereof

Package structure of folding magnetic coupling isolator and leadframe component and manufacturing method thereof

US Patent 10529657 · Granted Jan 7, 2020

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

High strength-ductility matched oxide-particles dispersion steel, preparation me2024
Low-dropout voltage regulator2024
Method for building spice circuit model of an optical coupler2022
MEMS device and electronics apparatus2021
Encoding and decoding method for optical isolation amplifier employing sigma-del2021
Comparator circuit with hysteresis function and a semiconductor device thereof2020
Package structure of a folding magnetic coupling isolator, leadframe component, 2020
Package structure of capacitive coupling isolator2020
Magnetic coupling package structure for magnetically coupled isolator with duo l2019
Differential transimpedance amplifier2019
Portable electronic device and optical proximity sensor module thereof having in2019
Buffer circuit2019