Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › In-situ metrology method for thickness measurement during PECVD processes

In-situ metrology method for thickness measurement during PECVD processes

US Patent 10527407 · Granted Jan 7, 2020

Estimated economic value: $68,481,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

In-situ reflectometry for real-time process control2025
In-situ reflectometry for real-time process control2025
In-situ reflectometry for real-time process control2025
Time delay integration acquisition for spatial genomics imaging2025
Semiconductor processing chambers and methods for deposition and etch2025
Methods, systems, and apparatus for monitoring radiation output of lamps2025
Subsurface alignment metrology system for packaging applications2025
Systems and methods for controlling non-uniformity2025
Image based metrology of surface deformations2025
System and method to map thickness variations of substrates in manufacturing sys2025
System and method to map thickness variations of substrates in manufacturing sys2025
Autonomous substrate processing system2025