Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Organic electronic device having dimension tolerance between encapsulating layer and metal layer less than or equal to 200 microns

Organic electronic device having dimension tolerance between encapsulating layer and metal layer less than or equal to 200 microns

US Patent 10522786 · Granted Dec 31, 2019

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Systems and methods for active curriculum learning2025
Automatically-chargeable spout type cosmetics container2025
Encapsulation film2025
Encapsulation film2025
Wearable device2025
Encapsulation film2025
Adhesive composition2025
Thin film transistor and display device including the same2025
Bridgeless power factor-improving converter2025
Encapsulation film having excellent reliability, organic electronic device compr2025
Encapsulation film having excellent reliability, organic electronic device compr2025
Resin composition2025