Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Hybrid chip-on-board LED module with patterned encapsulation

Hybrid chip-on-board LED module with patterned encapsulation

US Patent 10490710 · Granted Nov 26, 2019

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Low-density electrical traces on a transparent or reflective substrate2025
Multi-color phosphor converted LED package with single cavity2024
Integrated optical system for dynamic diffuse and directional lighting2024
Tunable lighting system with preferred color rendering2024
Light-emitting device array with individual cells2023
Color tunable light emitting diode (LED) systems, LED lighting systems, and meth2023
Lighting system with integrated sensor2023
Light emitting device with improved warm-white color point2023
Light emitting diode with high melanopic spectral content2023
Integrated optical system for dynamic diffuse and directional lighting2023
LED and phosphor combinations for high luminous efficacy lighting with superior 2023
Multi-color phosphor converted LED package with single cavity2022