Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Thermally-conductive electromagnetic interference (EMI) absorbers positioned or positionable between board level shields and heat sinks

Thermally-conductive electromagnetic interference (EMI) absorbers positioned or positionable between board level shields and heat sinks

US Patent 10477739 · Granted Nov 12, 2019

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electrostatic discharge protection of a power efficient stylus for an electronic2025
Electrostatic discharge robust design for input device2024
Board level shields with virtual grounding capability2019
Board level shields with virtual grounding capability2019
Soft and/or flexible EMI shields and related methods2019
Soft and/or flexible EMI shields and related methods2019
Absorber assemblies having a dielectric spacer, and corresponding methods of ass2019
Absorber assemblies having a dielectric spacer, and corresponding methods of ass2019
Board level shields with virtual grounding capability2018
Board level shields with virtual grounding capability2018
Thermal interface materials including electrically-conductive material2018
Thermal interface materials including electrically-conductive material2018