Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device with an interconnect structure and method for forming the same

Semiconductor device with an interconnect structure and method for forming the same

US Patent 10468299 · Granted Nov 5, 2019

Estimated economic value: $5,198,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Axial-flow heat-dissipation fan2025
Capacitor structure, semiconductor structure, and method for manufacturing the s2025
Centrifugal heat dissipation fan2025
High electron mobility transistor device and manufacturing method thereof2025
High electron mobility transistor device and manufacturing method thereof2025
Ultra-thin fin structure and method of fabricating the same2025
Control method of light field display2025
Centrifugal heat dissipation fan of portable electronic device2025
Semiconductor device having a metal pad and a protective layer for corrosion pre2024
Crop growth information monitoring method and device and method for manufacturin2024
Heat dissipation system of electronic device2024
Centrifugal heat dissipation fan2024