Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Face-to-face semiconductor assembly having semiconductor device in dielectric recess

Face-to-face semiconductor assembly having semiconductor device in dielectric recess

US Patent 10446526 · Granted Oct 15, 2019

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Leadframe substrate having modulator and crack inhibiting structure and flip chi2022
Leadframe substrate having modulator and crack inhibiting structure and flip chi2022
Interconnect substrate with stiffener and warp balancer and semiconductor assemb2020
Interconnect substrate with stiffener and warp balancer and semiconductor assemb2020
Methods of making wiring substrate for stackable semiconductor assembly and maki2020
Methods of making wiring substrate for stackable semiconductor assembly and maki2020
Wiring board having electrical isolator and moisture inhibiting cap incorporated2019
Wiring board having electrical isolator and moisture inhibiting cap incorporated2019
Wiring board having isolator and bridging element and method of making wiring bo2019
Wiring board having isolator and bridging element and method of making wiring bo2019
Semiconductor assembly with electromagnetic shielding and thermally enhanced cha2019
Semiconductor assembly with electromagnetic shielding and thermally enhanced cha2019