Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device and method of integrating power module with interposer and opposing substrates

Semiconductor device and method of integrating power module with interposer and opposing substrates

US Patent 10438932 · Granted Oct 8, 2019

Estimated economic value: $9,354,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of preparing programmable diode, programmable diode and ferroelectric mem2025
Memristor, method of calculating hamming distance, and in-memory computing integ2025
Pressure sensor based on zinc oxide nanowires and method of manufacturing pressu2025
All-electrically-controlled spintronic neuron device, neuron circuit and neural 2025
Memory cell structure, memory array structure, and voltage biasing method2025
Lighting apparatus2025
Semiconductor package electrical contacts and related methods2025
Substrate structures and methods of manufacture2025
Die sidewall coatings and related methods2025
Low stress asymmetric dual side module2025
Low stress asymmetric dual side module2025
Low stress asymmetric dual side module2025