Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Control of electric field effects in a printed circuit board assembly using embedded nickel-metal composite materials

Control of electric field effects in a printed circuit board assembly using embedded nickel-metal composite materials

US Patent 10420239 · Granted Sep 17, 2019

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Switching device with ceramic/glass eyelets2025
Control of electric field effects in a printed circuit board assembly using embe2024
Control of electric field effects in a printed circuit board assembly using embe2024
Control of electric field effects in a printed circuit board assembly using embe2022
Control of electric field effects in a printed circuit board assembly using embe2022
Circuit board with dielectric surface switch and embedded metamaterials providin2021
Method for assembling a printed circuit board assembly2021
Method for assembling a printed circuit board assembly2021
Control of electric field effects in a printed circuit board assembly using embe2018
Control of electric field effects in a printed circuit board assembly using embe2018
Fiber optic dielectric waveguide structure for modal multiplexed communication a2017
Predictive popular content replication2014